Cantilever:

F:
C:0.25N/m
L:150µm

Applications:

ScanningThermalMicroscopyAFMProbes

Description:

ScanningthermalmicroscopyprobewithintegratedPallADIumresistanceThermometerforthermalmappingincontactmode.Thetipcanbeheatedtomapthermalconductivityonpassivesamples,orbiasedtomeasurelocalhotspots.

Theprobesofferthefollowingfeatures:

• VisIBLetipcantilever
• Resistancethermometerlocatedatthetipapex.
• Resistance250to400Ω(typ320Ω)
• Sensitivity1Ω/ºC(approx)
• Siliconnitridecantilever(400nmthick)
• Talltipheight(~10um)forhighaspectratiofeatures
• Finetip(<100nmradius)forhighresolutionthermalmeasurements.
• MeasuretipresistancewithsimpleWheatstonebridgeorapplyapplyanA.C.signalanduselockindetector.
• Probebase: 2mmx3mm

ElectricalconnectionismadetotwoAupadsontheprobesbasebyeitherwirebonding,conductingepoxy/pasteormechanicalclips.

Otherapplicationsincludeapplyingsinglepointvoltages,providinglocalcurrentstimulus,ordetectingthermalpropertiesresultingincantileverdeflections(notgenerallysuitableforscanningun-insulatedelectricallyactivesampleswithoutelectronicstofloattheprobepotential). NanoAndMore 横向-(xy)-校准标准 (2D200)200 nm 间距精确横向校准的标准产品描述标准(2D200)用于对 AFM 扫描机制进行非常精确的 xy 校准。该标准由蚀刻到硅芯片中的具有 200nm 间距的倒置方形金字塔的二维晶格组成。有源区位于芯片的中心，四周是 FindMe 结构。倒金字塔的格子构成了活动区域。硅芯片粘在直径为 12 毫米的不锈钢样品架上。该支架可以磁性或机械固定。该产品将通过 Gel-Pak® 载体运输。本标准是与德国国家标准权威机构 PTB（Physikalisch Technische Bundesanstalt）密切合作制定的。因此，PTB 能够根据国际准则认证该标准。请直接通过www.ptb.de联系工作组 5.25 Scanning Probe Metrology 。Gel-Pak® 是 Delphon Industries 的注册商标