Cantilever:

F:75kHz
C:2.8N/m
L:225µm

Applications:

ColloidalAFMProbes
SphereAFMTips

Description:

TheFMtypeisofferedforforcemodulationmicroscopy.TheforceconstantofthisAFMprobespansthegapbetweencontactandnon-contactmodeandisspeciallytailoredfortheforcemodulationmode.

Thesocalled"ColloidalProbeTechnique",wheresinglecolloidsareattachedtoAFMcantileversforforcemeasurements,opensthechanceforabetterunderstandingoffundamentalinteractionsinavarietyoffields.

Examplesareadhesionphenomena,particle-surface-interactions,mechanicalproperties,sUSPensions,hydrodynamicsandboundaryslip-tonamejustsomeoutofanincreasingnumberofapplications.

Theprobeoffersuniquefeatures:

       -spherematerial:polymethylmethacrylate(PMMA)
       -excellentspherediameter:
         A=1.5µm,B=3.36µm,C=6.44µm,D=9.57µm,orE=14.59µm(all+/-5%)
         (Duetodifferentmassestheresonancefrequencycandiffer.)
         PleasechooseA,B,C,D,orE whenordering!
       -highlydopedsiliconcantilevertodissipatestaticcharge
       -chemicallyinert
       -highmechanicalQ-factorforhighsensitivity
       -precisealignmentofthecantileverpositionwhenusedtogetherwiththeAlignmentchip
         (within+/-2µm)
       -compatiblewithPointProbe®PlusXY-AlignmentSeries

*typicalrangeThisproductfeaturesalignmentgroovesonthebacksideoftheholderchip. NanoAndMore 横向-(xy)-校准标准 (2D200)200 nm 间距精确横向校准的标准产品描述标准(2D200)用于对 AFM 扫描机制进行非常精确的 xy 校准。该标准由蚀刻到硅芯片中的具有 200nm 间距的倒置方形金字塔的二维晶格组成。有源区位于芯片的中心，四周是 FindMe 结构。倒金字塔的格子构成了活动区域。硅芯片粘在直径为 12 毫米的不锈钢样品架上。该支架可以磁性或机械固定。该产品将通过 Gel-Pak® 载体运输。本标准是与德国国家标准权威机构 PTB（Physikalisch Technische Bundesanstalt）密切合作制定的。因此，PTB 能够根据国际准则认证该标准。请直接通过www.ptb.de联系工作组 5.25 Scanning Probe Metrology 。Gel-Pak® 是 Delphon Industries 的注册商标