Cantilever:
F:13kHz
C:0.2N/m
L:450µm
Applications:
Hardened/EnhancedWearResistanceAFMProbes
NanoindentationandLithographyAFMProbes
Description:
MonolithicsiliconAFMprobeforcontactmodeandlateralforcemodeoperation.
HighdurABIlityandhydrophobicity duetoDiamond-Like-Carboncoatingontipsideofthecantilever.
Therotatedtipallowsformoresymmetricrepresentationofhighsamplefeatures.TheconsistenttiprADIusensuresgoodresolutionandreproducibility.
TheAFMholderchipfitsmostcommercialAFMsystemsasitisindustrystandardsize.ItiscompatIBLewith:
- Bruker/Veeco/DigitalInstruments
- Keysight/Agilent/MolecularImaging
- AsylumResearch
- ParkSystems
- JEOL
- JPK
- etc.
FormeasurementsinliquidspleaseusethebacksidegoldcoatedContGD-GortheoverallgoldcoatedContGB-G!
Consistenthighqualityatalowerprice!
Diamond-Like-Carboncoatingontipsideofthecantilever,15nmthick;Aluminumcoatingondetectorsideofthecantilever,30nmthick
AFMTip:
AFMCantilever:
Beam450µm(440-460µm)*50µm(45-55µm)*2µm(1-3µm)*0.2N/m(0.07-0.4N/m)*13kHz(9-17kHz)* *typicalrange NanoAndMore 横向-(xy)-校准标准 (2D200)200 nm 间距精确横向校准的标准产品描述标准(2D200)用于对 AFM 扫描机制进行非常精确的 xy 校准。该标准由蚀刻到硅芯片中的具有 200nm 间距的倒置方形金字塔的二维晶格组成。有源区位于芯片的中心,四周是 FindMe 结构。倒金字塔的格子构成了活动区域。硅芯片粘在直径为 12 毫米的不锈钢样品架上。该支架可以磁性或机械固定。该产品将通过 Gel-Pak® 载体运输。本标准是与德国国家标准权威机构 PTB(Physikalisch Technische Bundesanstalt)密切合作制定的。因此,PTB 能够根据国际准则认证该标准。请直接通过www.ptb.de联系工作组 5.25 Scanning Probe Metrology 。Gel-Pak® 是 Delphon Industries 的注册商标