nanoandmore/PPP-LM-MFMR/PPP-LM-MFMR-50/Box of 50 AFM Probes

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¥54560.00
货号:PPP-LM-MFMR-50
浏览量:46
品牌:NanoAndMore
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商品描述

Cantilever:

F:75kHz
C:2.8N/m
L:225µm

Applications:

MagneticAFMProbes

Description:

TheNANOSENSORS™PPP-LM-MFMRAFMprobeisdesignedformagneticforcemicroscopywithreduceddisturbanceofthemagneticsamplebythetipandenhancedlateralresolution–comparedtothestandardPPP-MFMRprobe.Theforceconstantofthisprobetypeisspeciallytailoredformagneticforcemicroscopyyieldinghighforcesensitivitywhilesimultaneouslyenablingtappingmodeandliftmodeoperation.
Thehardmagneticcoatingonthetipischaracterizedbyacoercivityofapp.250Oeandaremanencemagnetizationofapp.150emu/cm3(thesevaluesweredeterminedonaflatsurface).

TheSPMprobeoffersuniquefeatures:
  • hardmagneticcoatingonthetipside(coercivityofapp.250Oe,remanencemagnetizationofapp.150emu/cm3)
  • effectivemagneticmoment0.5xofstandardprobes
  • metallicelectricalconductivity
  • guaranteedtiprADIusofcurvature<30nm
  • magneticresolutionbetterthan35nm
  • Alcoatingondetectorsideofcantileverenhancingthereflectivityofthelaserbeambyafactorofabout2.5
  • alignmentgroovesonbacksideofsiliconholderchip
  • precisealignmentofthecantileverposition(within+/-2µm)whenusedwiththeAlignmentChip
  • compatIBLewithPointProbe®PlusXY-AlignmentSeries
 
Asbothcoatingsarealmoststress-freethebendingofthecantileverduetostressislessthan3.5%ofthecantileverlength.Forenhancedsignalstrengththemagnetizationofthetipbymeansofastrongpermanentmagnetpriortothemeasurementisrecommended.
Asbothcoatingsarealmoststress-freethebendingofthecantileverduetostressislessthan3.5%ofthecantileverlength.Forenhancedsignalstrengththemagnetizationofthetipbymeansofastrongpermanentmagnetpriortothemeasurementisrecommended.

AFMTip:

  • AFMCantilever:

  • Beam
  • 225µm(215-235µm)*
  • 28µm(20-35µm)*
  • 3µm(2-4µm)*
  • 2.8N/m(0.5-9.5N/m)*
  • 75kHz(45-115kHz)*
  • *guaranteedrangeThisproductfeaturesalignmentgroovesonthebacksideoftheholderchip. NanoAndMore 横向-(xy)-校准标准 (2D200)200 nm 间距精确横向校准的标准产品描述标准(2D200)用于对 AFM 扫描机制进行非常精确的 xy 校准。该标准由蚀刻到硅芯片中的具有 200nm 间距的倒置方形金字塔的二维晶格组成。有源区位于芯片的中心,四周是 FindMe 结构。倒金字塔的格子构成了活动区域。硅芯片粘在直径为 12 毫米的不锈钢样品架上。该支架可以磁性或机械固定。该产品将通过 Gel-Pak® 载体运输。本标准是与德国国家标准权威机构 PTB(Physikalisch Technische Bundesanstalt)密切合作制定的。因此,PTB 能够根据国际准则认证该标准。请直接通过www.ptb.de联系工作组 5.25 Scanning Probe Metrology 。Gel-Pak® 是 Delphon Industries 的注册商标