nanoandmore/ATEC-CONTPt/ATEC-CONTPt-50/Box of 50 AFM Probes

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¥48197.45
货号:ATEC-CONTPt-50
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品牌:NanoAndMore
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商品描述

Cantilever:

F:15kHz
C:0.2N/m
L:450µm

Applications:

ConductiveAFMProbes

Description:

NANOSENSORS™AdvancedTEC™ContPtAFMprobesaredesignedforcontactmodeimaging.Theyfeatureatetrahedraltipthatprotrudesfromtheveryendofthecantilever.

ThisuniquefeatureallowsprecisepositioningandmakestheAdvancedTEC™theonlyAFMscanningprobeintheworldthatoffersREALTIPVISIBILITYFROMTOP,evenwhentheprobeistiltedduetoitsmountingontotheAFMhead.Thisfeaturemakesthemthepremiumchoiceforallapplicationswherethetiphastobeplacedexactlyonthepointofinterestand/orhastobevisIBLe(e.g.Nanomanipulation).

DuetotheirverysmallhalfconeanglesthetipsoftheAdvancedTEC™Seriesshowgreatperformanceonsamplesthathaveasmallpatternsizecombinedwithsteepsamplefeatures.

Theprobeoffersuniquefeatures:

  • REALTIPVISIBILITYFROMTOP
  • metallicconductivityofthetip
  • highmechanicalQ-factorforhighsensitivity
  • aspectratioofthelast1.5µmofthetip>4:1(fromfrontandside)
  • tipshapeisdefinedbyrealcrystalplanesresultinginhighlyreproduciblegeometriesandextremelysmoothsurfaces
  • highlydopedsinglecrystalsilicon(0.01-0.025Ohm*cm)
  • rectangularcantileverwithtrapezoidalcrosssection
  • holderdimensionsare1.6mmx3.4mm

Pleasenote:Wearatthetipcanoccurifoperatingincontact-,friction-orforcemodulationmodeorwhereitisnecessarytoconducthighcurrents.
ThePtIr5coatingisanapproximately25nmthickdoublelayerofchromiumandplatinumiridium5onbothsidesofthecantilever.Thetipsidecoatingenhancestheconductivityofthetipandallowselectricalcontacts.Thedetectorsidecoatingenhancesthereflectivityofthelaserbeambyafactorofabout2andpreventslightfrominterferingwithinthecantilever.Thecoatingprocessisoptimizedforstresscompensationandwearresistance.Thebendingofthecantileverduetostressislessthan3.5%ofthecantileverlength.

AFMTip:

  • AFMCantilever:

  • Beam
  • 450µm(440-460µm)*
  • 50µm(45-55µm)*
  • 2µm(1-3µm)*
  • 0.2N/m(0.02-0.75N/m)*
  • 15kHz(7-25kHz)*
  • *guaranteedrange NanoAndMore 横向-(xy)-校准标准 (2D200)200 nm 间距精确横向校准的标准产品描述标准(2D200)用于对 AFM 扫描机制进行非常精确的 xy 校准。该标准由蚀刻到硅芯片中的具有 200nm 间距的倒置方形金字塔的二维晶格组成。有源区位于芯片的中心,四周是 FindMe 结构。倒金字塔的格子构成了活动区域。硅芯片粘在直径为 12 毫米的不锈钢样品架上。该支架可以磁性或机械固定。该产品将通过 Gel-Pak® 载体运输。本标准是与德国国家标准权威机构 PTB(Physikalisch Technische Bundesanstalt)密切合作制定的。因此,PTB 能够根据国际准则认证该标准。请直接通过www.ptb.de联系工作组 5.25 Scanning Probe Metrology 。Gel-Pak® 是 Delphon Industries 的注册商标