Applications:
ConductiveAFMProbes
Description:
VersatilemonolithicsiliconAFMprobewith4differentplatinumcoatedcantileversonasingleAFMholderchipforvariousapplications:contactmode,forcemodulationmode,softtappingmodeandhighfrequencytapping/non-contactmodeandelectricmodessuchas:
- scanningcapacitancemicroscopy(SCM)
- electrostaticforcemicroscopy(EFM)
- Kelvinprobeforcemicroscopy(KFM)
TheshortcantileverendismarkedbyatrapezoidalpatternvisIBLewithbareeyes.
Therotatedtipsallowformoresymmetricrepresentationofhighsamplefeatures.TheconsistenttiprADIiensuregoodresolutionandreproducibility.
TheAFMholderchipfitsmostcommercialAFMsystemsasitisindustrystandardsize.Itiscompatiblewith:
- Bruker/Veeco/DigitalInstruments
- Keysight/Agilent/MolecularImaging
- AsylumResearch
- ParkSystems
- JEOL
- JPK
- etc.
Themainadvantageofthisproductcomparedtoregular,single-cantileverAFMprobesisthefreedomtochooseintheverylastmomenttherightcantileverforeachapplication.YoudontneedtostockvariousAFMProbetypesanymore.Nevertheless,thisproductisnotmeantasasubstitutiontocomparablesingle-cantileverAFMprobes,becausethegeometryofeachoneoftheElectriAll-In-Onecantileversdiffersfromthegeometryofcomparablespecializedsingle-cantileverAFMprobes.
BudgetSensorsoffersconsistenthighqualityatalowerprice!
Electricallyconductivecoatingof5nmChromiumand25nmPlatinumonbothsidesofthecantilever.Thiscoatingalsoenhancesthelaserreflectivityofthecantilever.
AFMTip:
Rotated17µm(15-19µm)*15µm(10-20µm)*<25=""nm="">20°-25°frontview,25°-30°fromside,10°attheapexAFMCantilevers:
CantileverA-ContactMode
Beam500µm(490-510µm)*30µm(25-35µm)*2.7µm(1.7-3.7µm)*0.2N/m(0.04-0.7N/m)*15kHz(10-20kHz)*CantileverB-ForceModulation
Beam210µm(200-220µm)*30µm(25-35µm)*2.7µm(1.7-3.7µm)*2.7N/m(0.4-10N/m)*80kHz(50-110kHz)*CantileverC-SoftTapping
Beam150µm(140-160µm)*30µm(25-35µm)*2.7µm(1.7-3.7µm)*7.4N/m(1-29N/m)*150kHz(70-230kHz)*CantileverD-TappingMode
Beam100µm(90-110µm)*50µm(45-55µm)*2.7µm(1.7-3.7µm)*40N/m(7-160N/m)*350kHz(200-500kHz)* *typicalrange NanoAndMore 横向-(xy)-校准标准 (2D200)200 nm 间距精确横向校准的标准产品描述标准(2D200)用于对 AFM 扫描机制进行非常精确的 xy 校准。该标准由蚀刻到硅芯片中的具有 200nm 间距的倒置方形金字塔的二维晶格组成。有源区位于芯片的中心,四周是 FindMe 结构。倒金字塔的格子构成了活动区域。硅芯片粘在直径为 12 毫米的不锈钢样品架上。该支架可以磁性或机械固定。该产品将通过 Gel-Pak® 载体运输。本标准是与德国国家标准权威机构 PTB(Physikalisch Technische Bundesanstalt)密切合作制定的。因此,PTB 能够根据国际准则认证该标准。请直接通过www.ptb.de联系工作组 5.25 Scanning Probe Metrology 。Gel-Pak® 是 Delphon Industries 的注册商标