Cantilever:

F:210kHz
C:72N/m
L:225µm

Applications:

Hardened/EnhancedWearResistanceAFMProbes
NanoindentationandLithographyAFMProbes
DiamondAFMProbes
Hardened/EnhancedWearResistanceTappingAFMProbes

Description:

NANOSENSORS™DT-NCLRAFMprobesaredesignedfornon-contactmodeortappingmodeAFM(alsoknownas:attractiveordynamicmode).TheNCLtypeisofferedasanalternativetoNANOSENSORS™highfrequencynon-contactprobee(NCH).TheNCLtypecantileverisrecommendedifthefeedbackloopofthemicroscopedoesnotaccepthighfrequencies(400kHz)orifthedetectionsystemneedsaminimumcantileverlength>125µm.

Comparedtothehighfrequencynon-contacttypeNCHthemaximumscanningspeedisslightlyreduced.ThisAFMprobecombineshighoperationstABIlitywithoutstandingsensitivityandfastscanningability.

Forapplicationsthatrequirehardcontactbetweentipandsamplethissensoroffersarealdiamondtip-sidecoating.Thiscoatingfeaturesextremelyhighwearresistanceduetotheunsurpassedhardnessofdiamond.ThetypicalmacroscopictiprADIusofcurvatureisbetween100and200nm.Nanoroughnessesinthe10nmregimeimprovetheresolutiononflatsurfaces.

Theprobeoffersuniquefeatures:

• realdiamondcoating
• highmechanicalQ-factorforhighsensitivity
• precisealignmentofthecantileverposition(within+/-2µm)whenusedwiththeAlignmentChip
• compatIBLewithPointProbe^®PlusXY-AlignmentSeries

*guaranteedrangeThisproductfeaturesalignmentgroovesonthebacksideoftheholderchip. NanoAndMore 横向-(xy)-校准标准 (2D200)200 nm 间距精确横向校准的标准产品描述标准(2D200)用于对 AFM 扫描机制进行非常精确的 xy 校准。该标准由蚀刻到硅芯片中的具有 200nm 间距的倒置方形金字塔的二维晶格组成。有源区位于芯片的中心，四周是 FindMe 结构。倒金字塔的格子构成了活动区域。硅芯片粘在直径为 12 毫米的不锈钢样品架上。该支架可以磁性或机械固定。该产品将通过 Gel-Pak® 载体运输。本标准是与德国国家标准权威机构 PTB（Physikalisch Technische Bundesanstalt）密切合作制定的。因此，PTB 能够根据国际准则认证该标准。请直接通过www.ptb.de联系工作组 5.25 Scanning Probe Metrology 。Gel-Pak® 是 Delphon Industries 的注册商标