Cantilever:
F:130kHz
C:15N/m
L:225µm
Applications:
SupersharpAFMProbes
SupersharpTappingModeAFMProbes
Description:
ForownersofaSeikoInstrumentsmicroscopeusingthenon-contactmodewerecommendtheNANOSENSORS™SEIH type(SeikoInstruments/highforceconstant).ComparedwiththeZEIHtypetheforceconstantisfurtherreduced.
ForenhancedresolutionofnanostructuresandmicroroughnessweofferourSuperSharpSilicon™tipwithunrivalledsharpness.
Theprobeoffersuniquefeatures:
- excellenttiprADIusofcurvature
- typicalaspectratioat200nmfromtipapexintheorderof4:1
- highlydopedsilicontodissipatestaticcharge
- highmechanicalQ-factorforhighsensitivity
- precisealignmentofthecantileverposition(within+/-2µm)whenusedwiththeAlignmentChip
- compatIBLewithPointProbe®PlusXY-AlignmentSeries
Thereflexcoatingisanapproximately30nmthickaluminumcoatingonthedetectorsideofthecantileverwhichenhancesthereflectivityofthelaserbeambyafactorofabout2.5.Fur
Thermoreitpreventslightfrominterferingwithinthecantilever.Thevirtuallystress-freecoatingisbendingthecantileverlessthan2%ofthecantileverlength.
AFMTip:
AFMCantilever:
Beam225µm(215-235µm)*33µm(30-45µm)*5µm(4-6µm)*15N/m(5-37N/m)*130kHz(96-175kHz)* *guaranteedrange NanoAndMore 横向-(xy)-校准标准 (2D200)200 nm 间距精确横向校准的标准产品描述标准(2D200)用于对 AFM 扫描机制进行非常精确的 xy 校准。该标准由蚀刻到硅芯片中的具有 200nm 间距的倒置方形金字塔的二维晶格组成。有源区位于芯片的中心,四周是 FindMe 结构。倒金字塔的格子构成了活动区域。硅芯片粘在直径为 12 毫米的不锈钢样品架上。该支架可以磁性或机械固定。该产品将通过 Gel-Pak® 载体运输。本标准是与德国国家标准权威机构 PTB(Physikalisch Technische Bundesanstalt)密切合作制定的。因此,PTB 能够根据国际准则认证该标准。请直接通过www.ptb.de联系工作组 5.25 Scanning Probe Metrology 。Gel-Pak® 是 Delphon Industries 的注册商标