Inverted Metallurgical MicroscopeMetal-inv 3.0 MegapixelsProduct DescriptionIntroductionMetal-inv Metallurgical Microscope is widely used to study PCB boards, LCD displays and metal structure observation and inspection. With the top mounted sample stage and convenient operation, it will be a great choice.Features

• Viewing head -Binocular, 45° inclined, Interpupillary Distance 55-75mm
• Camera -CMOS 3.0 Megapixels, 1600 x 1280
• Objectives -10X, 100X(S, Oil) 45mm DIN Achromatic, 40X(S) Metallurgical Plan-Scope Achromatic
• Eyepiece -WF10X, WF12.5X, WF10X with 0.1mm Cross Micrometer, WF10x Micro-ruler: 0.01mm/scale
• Nosepiece -Backward Triple
• Total magnification -100X to 1250X
• Stage -Double Layer Mechanical 200 x 180mm with Two Plates (Ø10 and Ø20mm), Moving range X-Y 70 x 50mm
• Condenser -N/A
• Focus -Coaxial Course & Fine Focusing Mechanism by Rack & Pinion with Tension Adjustment and Stage Height Limited Knob, Focusing Range 25mm, Fine Division 0.002mm
• Filter -Blue, Green, Yellow, Ground Glass
• Illumination -Kohler Illumination, Epi-illminator with Iris Aperture Diaphragm and Iris Field Diaphragm, 6V 20W Halogen Lamp, 110-220V, Brightness Adjustable
• Minimum system requirements -Pentium P4, 256MB Memory, 512MB hard disk, 1024 x 768, USB 2.0, Windows XP/2000/Vista
• USB Connection -USB 2.0
• Software -Image Capture in BMP and JPG, Live Video on PC Monitor, Functions Include: Previewing, Saving, Measuring, Comparing, Counting and Deleting
• Weight -13 kg
• Dimensions -42 x 35 x 52 cm

NanoAndMore 横向-(xy)-校准标准 (2D200)200 nm 间距精确横向校准的标准产品描述标准(2D200)用于对 AFM 扫描机制进行非常精确的 xy 校准。该标准由蚀刻到硅芯片中的具有 200nm 间距的倒置方形金字塔的二维晶格组成。有源区位于芯片的中心，四周是 FindMe 结构。倒金字塔的格子构成了活动区域。硅芯片粘在直径为 12 毫米的不锈钢样品架上。该支架可以磁性或机械固定。该产品将通过 Gel-Pak® 载体运输。本标准是与德国国家标准权威机构 PTB（Physikalisch Technische Bundesanstalt）密切合作制定的。因此，PTB 能够根据国际准则认证该标准。请直接通过www.ptb.de联系工作组 5.25 Scanning Probe Metrology 。Gel-Pak® 是 Delphon Industries 的注册商标